Because of issues with the 32nm silicon-on-insulator process technologyBack in April, it was revealed that Advanced Micro Devices had come far enough in their making of the Fusion Llano APU that sampling had already started. It was also implied that volume production would commence during the later half of the ongoing year. Unfortunately, it appears that AMD won't be able to match Intel's enthusiasm and speed up the coming of the Llano to market. Apparently, some issues have arisen that will push back the availability of the APU (accelerated processing unit) by about two months.
Fusion is a technology that merges multi-core CPUs with DirectX 11 graphics. During a recent conversation with financial analysts, as X-bit labs reports it, it was stated that some problems had appeared with the 32nm silicon-on-insulator process technology. Prior to these difficulties, the llano was slated for release in the fourth quarter of 2010. Now, the launch has been set for early 2011, most likely during January, though nothing is completely certain. The exact problems have not been elaborated upon, but either Llano APU itself has flaws or it is hard to mold it to the 32nm SOI process itself.
"Llano - our Fusion APU offering aimed at the higher end of the client market - is generating positive customer response. However, in reaction to Ontario’s market opportunities and a slower than anticipated progress of 32 nm yield curve, we are switching the timing of the Ontario and Llano production ramps. Llano production shipments are still expected to occur in the first half of next year," said Dirk Meyer, chief executive officer of AMD, during a conversation with financial analysts.
"We have seen the rate of yield leaning below our plans on 32nm. [...] We take a bit more time to work on the 32nm yields up the curve. So, the effective change [...] to our internal plans on Llano amounts to a couple of months," said Mr. Meyer.