Kingston posted a couple of pictures showing the prototype versions of its upcoming memory modules that will support liquid cooling. This will be a variation of Kingston's well established HyperX memory line and is currently in testing stage in the company's laboratories. According to the company itself, the test results are already proving quite satisfactory.
The memory maker is not the only one with the idea of taking advantage of the holiday period rather poor in the news department, with Gigabyte, NVIDIA, AMD, OLPC, Toshiba, Cooler Master and BenQ, among others, also revealing or detailing current or upcoming technologies and/or products of their own.
Unlike some of its peers, however, Kingston has not made public any kind of specific details, leaving end-users to their own speculative discussions on the clock speeds, temperatures and voltage modifications the memory will be able to handle. From the photographs, one can at least venture a guess as to how the mechanism will function and just how DIMM chips can be liquid-cooled.
The construction seems to indicate that the only part of the upcoming memory modules, which will actually make any contact with the used liquid is the heat spreader. This means that Kingston won't be revealing any new type of memory chips, most likely using the DDR3 memory type and standard print circuits approved by JEDEC.
The pictures show the DRAM liquid-cooling mechanism being tested on DDR3 DIMMs paired with an X58 motherboard. Even despite this configuration, the higher probability is that the new memory will be aimed at LGA 1156 or even AM3-powered configurations.
Kingston did not even allude to the launch date or price, but the fact that the product is already in lab testing stage seems to indicate that the actual availability of the new HyperX is only a few weeks away.